- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/535 - Arrangements for conducting electric current within the device in operation from one component to another including internal interconnections, e.g. cross-under constructions
Patent holdings for IPC class H01L 23/535
Total number of patents in this class: 2497
10-year publication summary
70
|
272
|
412
|
351
|
309
|
253
|
245
|
320
|
312
|
81
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
505 |
Samsung Electronics Co., Ltd. | 131630 |
305 |
International Business Machines Corporation | 60644 |
195 |
GLOBALFOUNDRIES U.S. Inc. | 6459 |
124 |
Micron Technology, Inc. | 24960 |
119 |
Intel Corporation | 45621 |
74 |
United Microelectronics Corp. | 3921 |
72 |
Kioxia Corporation | 9847 |
68 |
SK Hynix Inc. | 11030 |
66 |
Yangtze Memory Technologies Co., Ltd. | 1940 |
52 |
Renesas Electronics Corporation | 6305 |
46 |
Sandisk Technologies LLC | 5684 |
44 |
Nanya Technology Corporation | 2000 |
39 |
Qualcomm Incorporated | 76576 |
31 |
Semiconductor Manufacturing International (Shanghai) Corporation | 1764 |
31 |
Macronix International Co., Ltd. | 2562 |
29 |
Semiconductor Manufacturing International (Beijing) Corporation | 1019 |
24 |
Texas Instruments Incorporated | 19376 |
22 |
Rohm Co., Ltd. | 5843 |
18 |
Skyworks Solutions, Inc. | 3450 |
18 |
Other owners | 615 |